# Flip Chip Die Bonder Awarded · Tender **This opportunity has been awarded. Its page stays for reference.** Similar open opportunities: - [Hand-Foot-Clothing-Monitors FAIR BSA](https://inteliwert.com/tender/opp_ETJN9NVPXS4Q3VZYEVJ4C4FT9Z/hand-foot-clothing-monitors-fair-bsa) - [Präqualifikationsverfahren für Fernwirkschränke in Ortsnetzstationen](https://inteliwert.com/tender/opp_R6E2YGVC1NAD01HY8CZ0VBFRGB/praequalifikationsverfahren-fuer-fernwirkschraenke-in-ortsnetzstationen) - [Implementierung eines PLS an den HRB des Wasserverbandes Kleebach](https://inteliwert.com/tender/opp_H4CEZ1A97XXF61Y9BZT7P6W62Z/implementierung-eines-pls-an-den-hrb-des-wasserverbandes-kleebach) - [Mettler XPR2U microbalance](https://inteliwert.com/tender/opp_CQCXGAYDM6JN3JDNRB6WPZ4BFB/mettler-xpr2u-microbalance) - [GIS Geodatenservice und WebGIS](https://inteliwert.com/tender/opp_737PAN6JEH3WKE1CJP9RS0Y57A/gis-geodatenservice-und-webgis) ## At a glance FAIR - Facility for Antiproton and Ion Research in Europe GmbH is procuring Laboratory, optical and precision equipments (excl. glasses) (CPV 38000000) in Darmstadt, Kreisfreie Stadt (DE711). It has been awarded. Procedure type: Open. ### From the notice In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding. ## Key facts - Status: Awarded - Deadline: No deadline in the notice - Buyer: [FAIR - Facility for Antiproton and Ion Research in Europe GmbH](https://inteliwert.com/company/org_M1X8ST63WZT1DJ03DJSRR13EZQ/fair-facility-for-antiproton-and-ion-research-in-europe-gmbh), Darmstadt, DE - Place of performance: Darmstadt, Kreisfreie Stadt (DE711) - Main CPV: Laboratory, optical and precision equipments (excl. glasses) (CPV 38000000) - Procedure: Open - Lots: 1 - First published: 28 September 2026, 09:13 (UTC+02:00) Source: [Official notice](https://oeffentlichevergabe.de/ui/de/notices/3a782033-ba05-4a7b-a3c7-c07edf40f90c). Each fact is from the official notice, last checked 7 November 2026, 00:30 (UTC+01:00). Fact sheet: [Inteliwert fact sheet: Flip Chip Die Bonder — FAIR - Facility for Antiproton and Ion Research in Europe GmbH. A product of Bandpey GmbH.](https://inteliwert.com/cards/opp_B4F0594AFD30C7VNQR9NVWNVQB/ntv_G8X47MZP8RVFZJQV6YTE7R57JN/en-sheet.png) (PNG, 1600 × 900) ## Lots (1) ### Lot LOT-0001: Flip Chip Die Bonder The Flip-chip Die bonder should include the following process modules: \- Precision die bonding (face up) \- Flip chip bonding (face down) \- adapted system work table \- chip and substrate heating with process gas enclosure \- software-controlled bonding force module \- ultrasonic bonding module \- in-situ-monitoring with video camera \- form generator for creating reference elements for face up alignment \- tool tip changing module \- three different tool tips \- tool tip support including heater \- dispenser module for paste and liquids \- UV-curing module \- die-eject module - CPV: Laboratory, optical and precision equipments (excl. glasses) (CPV 38000000) - Place: Darmstadt, Kreisfreie Stadt (DE711) ## Timeline - 28 September 2026, 09:13 (UTC+02:00): Award notice, Notice, version 01 (Contract or concession award notice – standard regime), [Official notice](https://oeffentlichevergabe.de/ui/de/notices/3a782033-ba05-4a7b-a3c7-c07edf40f90c) - 28 September 2026: Award. Winner: Finetech GmbH & Co. KG; Award value: €234,757 excl. VAT; Tenders received: 1 ## Classification - CPV codes: Laboratory, optical and precision equipments (excl. glasses) (CPV 38000000) - NUTS regions: Darmstadt, Kreisfreie Stadt (DE711) - Other parties in the notice: Finetech GmbH & Co. KG (Tenderer); Finetech GmbH & Co. KG (Winner) ## Official documents No documents found in the indexed notice. ## Questions and answers ### Who is the buyer? FAIR - Facility for Antiproton and Ion Research in Europe GmbH, Darmstadt, DE. ### What is being procured (CPV)? Laboratory, optical and precision equipments (excl. glasses) (CPV 38000000). ### Where is the work performed (NUTS)? Darmstadt, Kreisfreie Stadt (DE711). ### Is it divided into lots? No, the notice names a single lot. ### Which procedure is used? Open. ### How do I submit a bid? On the official notice or the portal it names. Inteliwert does not submit bids. [Official notice](https://oeffentlichevergabe.de/ui/de/notices/3a782033-ba05-4a7b-a3c7-c07edf40f90c) ### Am I eligible? Inteliwert does not judge eligibility. The selection criteria are in the official notice. 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Inteliwert shows what the notice states and links to it. --- Page: https://inteliwert.com/tender/opp_B4F0594AFD30C7VNQR9NVWNVQB/flip-chip-die-bonder Inteliwert is a product of Bandpey GmbH, an international data and AI software company in Munich, Germany, founded and led by Roozbeh Bandpey. Bandpey's products: Facthory, Emolysis, Copolly and Inteliwert. Inteliwert on LinkedIn: https://www.linkedin.com/company/intelliwert, GitHub: https://github.com/inteliwertai.