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Flip Chip Die Bonder
At a glance
FAIR - Facility for Antiproton and Ion Research in Europe GmbH is procuring Laboratory, optical and precision equipments (excl. glasses) (CPV 38000000) in Darmstadt, Kreisfreie Stadt (DE711). It has been awarded. Procedure type: Open.
From the notice
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Key facts
Each fact is from the official notice, last checked 7 November 2026, 00:30 (UTC+01:00).
- Status
- AwardedOfficial notice · checked 7 Nov 2026, 00:30 (UTC+01:00)
- Deadline
- No deadline in the noticeOfficial notice · checked 7 Nov 2026, 00:30 (UTC+01:00)
- Buyer
- FAIR - Facility for Antiproton and Ion Research in Europe GmbH, Darmstadt, DEOfficial notice · checked 7 Nov 2026, 00:30 (UTC+01:00)
- Place of performance
- Darmstadt, Kreisfreie Stadt (DE711)Official notice · checked 7 Nov 2026, 00:30 (UTC+01:00)
- Main CPV
- Laboratory, optical and precision equipments (excl. glasses) (CPV 38000000)Official notice · checked 7 Nov 2026, 00:30 (UTC+01:00)
- Procedure
- OpenOfficial notice · checked 7 Nov 2026, 00:30 (UTC+01:00)
- Lots
- 1Official notice · checked 7 Nov 2026, 00:30 (UTC+01:00)
- First published
- 28 September 2026, 09:13 (UTC+02:00)Official notice · checked 7 Nov 2026, 00:30 (UTC+01:00)
Fact sheet

Lots (1)
Lot LOT-0001: Flip Chip Die Bonder
The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module
Timeline
- 28 September 2026: Award. Winner: Finetech GmbH & Co. KG; Award value: €234,757 excl. VAT; Tenders received: 1; Lot LOT-0001.
- 28 September 2026, 09:13 (UTC+02:00): Award notice Notice, version 01 (Contract or concession award notice – standard regime). Official notice
Buyer and place
Buyer
FAIR - Facility for Antiproton and Ion Research in Europe GmbH
Darmstadt, DE
Place of performance
- Darmstadt, Kreisfreie Stadt (DE711)
Other parties in the notice
- Finetech GmbH & Co. KG (Tenderer), Berlin
- Finetech GmbH & Co. KG (Winner), Berlin
Classification
CPV codes
- 38000000: Laboratory, optical and precision equipments (excl. glasses)
NUTS regions
- DE711: Darmstadt, Kreisfreie Stadt
Official documents
No documents found in the indexed notice.
Questions and answers
Who is the buyer?
FAIR - Facility for Antiproton and Ion Research in Europe GmbH, Darmstadt, DE.
What is being procured (CPV)?
Laboratory, optical and precision equipments (excl. glasses) (CPV 38000000).
Where is the work performed (NUTS)?
Darmstadt, Kreisfreie Stadt (DE711).
Is it divided into lots?
No, the notice names a single lot.
Which procedure is used?
Open.
How do I submit a bid?
On the official notice or the portal it names. Inteliwert does not submit bids. Official notice
Am I eligible?
Inteliwert does not judge eligibility. The selection criteria are in the official notice. Official notice
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Source
- Publisher
- Bekanntmachungsservice
- Licence
- CC0 1.0
- Last checked
- 7 November 2026, 00:30 (UTC+01:00)
The official notice is authoritative. Inteliwert shows what the notice states and links to it.